Epoxy Resin Adhesive

Our factory offers high-performance epoxy resin adhesives engineered for industrial, electronics, automotive, and structural applications. These adhesives provide excellent mechanical strength, chemical resistance, and long-term durability.

Key Technical Highlights:

Tensile Strength: ~20–50 MPa (ASTM D638)
Shear Strength: ~10–30 MPa (ASTM D1002)
Service Temperature: -40°C to 120°C
Curing: Room temperature or heat-assisted, depending on type

Epoxy resin adhesives ensure reliable bonding under demanding industrial conditions, from assembly lines to high-stress structural components.

Epoxy Resin Adhesive Product

Product List

Two-component Epoxy Adhesive

A two-part epoxy system providing strong bonding, chemical resistance, and durable performance for industrial assemblies.

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Electronic Potting Compound

Protective epoxy or silicone potting material designed to encapsulate electronic components for insulation, moisture resistance, and long-term reliability.

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Epoxy Structural Adhesive

High-strength structural epoxy ideal for load-bearing joints, delivering excellent mechanical strength and long-term durability across various substrates.

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Product Models

Q-EP-AB-TP10 (A/B) High Clarity Epoxy AB Adhesive
Q-EP-AB-TP20 (A/B) Ultra Low Yellowing Epoxy AB Adhesive
Q-EP-AB-TP30 (A/B) Fast Cure Clear Epoxy AB Adhesive
Q-EP-AB-TP40 (A/B) Flexible Clear Epoxy AB Adhesive
Q-EP-AB-TP50 (A/B) High Temp Resistant Clear Epoxy AB Adhesive
Q-EP-AB-TP60 (A/B) Optical Grade Epoxy AB Adhesive

Addition Cure

Q-SI-PT-AD10 Platinum Cure Silicone Potting Gel
Q-SI-PT-AD20 Thermal Conductive Addition Cure Potting Compound
Q-SI-PT-AD30 High Strength Addition Cure Potting Silicone
Q-SI-PT-AD40 Electronic Grade Platinum Cure Potting Gel

Condensation Cure

Q-SI-PT-CO10 Neutral Cure Silicone Potting Compound
Q-SI-PT-CO20 RTV Silicone Potting Compound for High Power Devices
Q-SI-PT-CO30 Low Cost Condensation Cure Potting Silicone
Q-SI-PT-CO40 Fast Cure Condensation Potting Compound

Two-Part Epoxy Potting Compounds

Q-EP-PT-1010 General Purpose Epoxy Potting Compound
Q-EP-PT-FL200 Flexible Epoxy Potting Compound
Q-EP-PT-1030 Thermal Conductive Epoxy Potting Compound
Q-EP-PT-1040 Underfill Encapsulation Epoxy
Q-EP-PT-1050 Flame Retardant Epoxy Potting Compound
Q-EP-PT-1060 High TG Epoxy Potting Compound for High Temp Applications

Two-Part Polyurethane Potting Compounds

Q-PU-PT-2010 Flexible Polyurethane Potting Compound
Q-PU-PT-WP20 Waterproof Polyurethane Potting Compound
Q-PU-PT-2030 Optical Clear Polyurethane Potting Compound
Q-PU-PT-2040 Thermal Conductive Polyurethane Potting Compound

Q-EP-ST-HS10 Ultra High Strength Structural Epoxy Adhesive
Q-EP-ST-FL10 High Temperature Resistance Structural Epoxy
Q-EP-ST-RC10 Flexible Structural Epoxy Adhesive
Q-EP-ST-F20 Underwater/Chemical Resistant Structural Epoxy
Q-EP-ST-R10 Rapid Cure Structural Epoxy Adhesive
Q-EP-ST-W10 Low Viscosity Penetrating Structural Epoxy
Q-EP-ST-C10 Carbon Fiber Reinforced Structural Paste
Q-EP-ST-M10 Metal Filled Conductive Structural Epoxy
Q-EP-ST-A10 Optical Grade Structural Epoxy Adhesive
Q-EP-ST-G10 General Purpose Structural Epoxy Adhesive

Why Choose Our Epoxy Resin Adhesives

Engineered for professional and industrial applications, our epoxy adhesives combine strength, durability, and versatility.

Superior Mechanical Performance

Deliver high tensile and shear strength for demanding structural applications.

High bond strength
Load-bearing capability
Long-term stability

Chemical & Thermal Resistance

Formulated to resist solvents, oils, water, and heat for industrial environments.

Excellent chemical resistance
High-temperature tolerance
Long-term aging stability

Versatile Application

Suitable for a wide range of substrates, including metals, plastics, composites, and ceramics.

Multi-substrate compatibility
Adhesive, sealing, or potting applications
Compatible with automated or manual processes

Versatile Applications

Epoxy resin adhesives are widely used for bonding, sealing, and potting applications across multiple industries. Their high strength, chemical stability, and durability make them ideal for both structural and protective purposes.

Construction & Architecture

Ideal for structural bonding, joint sealing, and flooring applications.

Metal and composite bonding
Structural glazing
Flooring and façade adhesion

Automotive & Transportation

Used in vehicle assembly, engine components, and interior/exterior trim.

Body panel bonding
Engine component adhesion
Trim and gasket sealing

Electronics & Electrical

Perfect for potting, encapsulation, and insulation of sensitive components.

PCB and component sealing
Thermal management
Electrical insulation

Industrial Manufacturing

Supports machinery assembly, piping systems, and heavy-duty industrial bonding.

Equipment assembly
Pipeline sealing
Vibration damping and structural reinforcement

Frequently Asked Questions

Epoxy adhesives bond metals, plastics, composites, ceramics, wood, and glass. Surface preparation and primer use may be required for certain low-energy plastics.

Two-component adhesives cure in 24–72 hours at room temperature; heat-assisted curing can accelerate strength development. UV-curable adhesives cure within seconds under proper UV light.

Yes. High-temperature formulations maintain bond strength up to 120°C (some specialty grades up to 180°C).

Standard epoxies are sensitive to moisture during curing. Moisture-tolerant or fast-curing variants are recommended for high-humidity environments.

Store two-component adhesives at 5–25°C in sealed containers. Avoid exposure to direct sunlight, heat, or moisture. Shelf life varies by product (typically 6–12 months).

Yes. Most industrial-grade epoxies are resistant to water, oils, fuels, and common solvents. For aggressive chemicals, select specific chemical-resistant grades.

Consider substrate compatibility, curing conditions, mechanical requirements, and environmental exposure. General-purpose adhesives suit most applications; high-strength, high-temperature, or conductive variants meet specialized requirements.

Yes. Low-viscosity or UV-curable epoxy grades are suitable for potting and encapsulating electronic components or mechanical assemblies. Controlled curing ensures minimal voids and excellent protection.

Ready to Get Started?

Ready to discuss your sealant requirements? Our technical team is here to provide expert consultation and competitive quotations.

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