| Addition-type silicone potting compound | UL 94 V-0 | Viscosity (after mixing):1,000 – 50,000 mPa·s (from levelable to thixotropic paste) | Temperature range:-60°C to200°C(long) | Curing type:Addition reaction,No small molecule release | Mixing ratio:Typically, the ratio is 1:1 (by weight or volume). |
| IEC 61086 | Hardness (after curing): Very soft (Shore 00 10-40) to medium (Shore A 30-60) | Resistance to thermal shock: Excellent; the elastomer can absorb stress. | Purity (AD40): Electronic grade, low ion content (Na⁺, K⁺, Cl⁻), low corrosivity | Operating time/in-vessel life: 30 minutes – 4 hours (25°C) |
| Tensile strength: 0.5 – 5.0 MPa (AD30 is a high-strength type) | Weather resistance: Excellent resistance to UV and ozone. | Inhibitors: Some contain inhibitors, which can provide working time and allow for rapid curing after heating. | Curing conditions: Room temperature or accelerated by heating (e.g., 80°C/1 hour) |
| Thermal conductivity (AD20): 0.3 – 1.5 W/m·K | | | |
| Condensation-type silicone potting compound | UL 94 V-0 | Viscosity (after mixing):5,000 – 80,000 mPa·s | Temperature range:-60°C to180°C(CO20 is used in high-power devices in the long term) | Curing type:Condensation reaction, releaseethanol or methanol(neutral) | Mixing ratio:Non-1:1 ratios are common (e.g., 10:1). |
| RoHS, REACH | Hardness (after curing): Shore A 20 – 50 | Weather resistance: Excellent | Shrinkage rate: Slight shrinkage (~0.5%) | Processing time: Standard type: 30-60 minutes; Quick-setting type (CO40): 5-20 minutes |
| Tensile strength: 0.8 – 2.5 MPa | | Cost: A low-cost model (CO30) is available. | Surface drying/curing depth: Curing depth is affected by ambient humidity; deeper curing is slower. |
| Thermal conductivity (CO2O): 0.4 – 1.2 W/m·K | | | |
| Epoxy Resin Potting Compound | UL 94 V-0 (1050), | Viscosity (after mixing):Medium to high viscosity, strong thixotropic | Temperature range: -40°C to 150-180°C (long-term, 1060 high Tg type) | Components:Two components, with various mixing ratios | Operation time:30 minutes – 2 hours |
| IEC 61086 | Hardness (after curing): Shore D 70-90 (rigid), Shore A 50-80 (FL200 flexible type) | Chemical resistance: Excellent, resistant to strong acids, strong alkalis, and solvents. | Flame retardancy (1050): UL 94 V-0 | Curing conditions: Often requires heat curing to achieve optimal performance. |
| Tensile/bending strength: 30 – 80 MPa (rigid type) | Low hygroscopicity: Excellent, providing optimal moisture protection. | | Application (1040): Underfill adhesive, low viscosity, high flowability, used for CSP/BGA underfill. |
| Thermal conductivity (1030): 0.8 – 2.5 W/m·K | | | |
| Glass transition temperature Tg (1060): ≥ 120°C (high Tg type) | | | |
| Polyurethane potting compound | RoHS, REACH | Viscosity (after mixing):1,000 – 20,000 mPa·s | Temperature range: -50°C to 125°C (long-term) | Curing type:Moisture curing or two-component reaction | Operation time:20 – 60 minutes |
| Hardness (after curing): Shore A 30 – 70 (flexible) | Resistance to thermal shock: Excellent, superior to epoxy and silicone. | Hydrolysis resistance: Generally, improved in high-performance models. | Curing speed: Relatively slow; requires moisture-proof storage. |
| Elongation at break: 100% – 400% (2010 flexible type) | Water resistance (WP20): Excellent, waterproof seal | | |
| Light transmittance (2030): ≥ 90% (optically transparent type) | | | |
| Thermal conductivity (2040): 0.3 – 1.0 W/m·K | | | |
